| Обозначение | Заглавие на русском языке | Статус | Язык документа | Цена (с НДС 20%)
в рублях |
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Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
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Published |
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На языке оригинала
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958,00
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Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
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Published |
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На языке оригинала
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958,00
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Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
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Published |
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На языке оригинала
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1058,00
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Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
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Published |
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На языке оригинала
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958,00
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Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Published |
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На языке оригинала
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1613,00
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Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
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Published |
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На языке оригинала
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1411,00
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Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
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Published |
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На языке оригинала
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1411,00
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Semiconductor devices—Mechanical and climatic test methods—Part 23:High temperature operating life
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Published |
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На языке оригинала
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1310,00
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Semiconductor devices—Mechanical and climatic test methods—Part 26: Electrostatic discharge (ESD) sensitivity testing—Human body model（HBM）
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Published |
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На языке оригинала
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3226,00
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Semiconductor devices—Mechanical and climatic test methods—Part 27: Electrostatic discharge(ESD) sensitivity testing—Machine model(MM)
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Published |
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На языке оригинала
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1310,00
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Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
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Published |
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На языке оригинала
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1058,00
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Semiconductor devices—Mechanical and climatic test methods—Part 31:Flammability of platic-encapsulated devices（internally induced）
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Published |
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На языке оригинала
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1008,00
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Semiconductor devices—Mechanical and climatic test methods—Part 32:Flammability of platic-encapsulated devices（externally induced）
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Published |
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На языке оригинала
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1008,00
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Semiconductor devices—Mechanical and climatic test methods—Part 42:Temperature and humidity storage
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Published |
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На языке оригинала
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1210,00
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Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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Published |
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На языке оригинала
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1966,00
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Classification and designation for getter
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Published |
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На языке оригинала
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958,00
|
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Measurement of the dimensionsof a cylindrical component having two axial terminations
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Published |
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На языке оригинала
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958,00
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Method for the determination of the space required by capacitors and resistors with unidirectional terminations
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Published |
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На языке оригинала
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958,00
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Guide for the collection of reliabilityпјЊavailability and maintainability data from field performance of electronic items
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Published |
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На языке оригинала
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958,00
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Electromechanical components for electronic equipment--Basic testing procedures and measuringmethods--Part 1:General
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Published |
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На языке оригинала
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1210,00
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